Laminated metal thin plate formed by electrodeposition and...

Details Laminated metal thin plate formed by electrodeposition and... Laminated metal thin plate formed by electrodeposition and...

2008-07-01

2008-07-01

Zimmerman, John J. (Department: 1794)

Stock material or miscellaneous articles

All metal or with adjacent metals

Having composition, density, or hardness gradient

C428S635000, C428S675000, C428S680000, C428S935000, C205S067000, C205S181000

Reexamination Certificate

active

10985982

ABSTRACT:
A laminated metal thin plate produced by electrodeposition is composed of a plurality of metal layers provided by at least two kinds of materials different in composition from each other. The laminated metal thin plate includes a first layer excellent in mechanical characteristics and/or chemical resistance and a second layer excellent in electrical characteristics such as electrical conductivity. The first and the second layers are adhered to each other in atomic level directly at their interface, with composition gradient at their interface, or with an adherence buffer layer such as a copper thin film interposed therebetween. The first layer is at first deposited on an electrode substrate. The second layer is deposited on the first layer. Deposition is repeatedly carried out in such a way that the first layers on opposite sides of the second layer are equal in thickness. Finally, the electrode substrate is dissolved and removed.

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Translation of JP 2001-342591.

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