Laminated member for circuit board, method and apparatus for...

Details Laminated member for circuit board, method and apparatus for... Laminated member for circuit board, method and apparatus for...

2004-01-21

2009-06-02

Norris, Jeremy C (Department: 2841)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S846000

Reexamination Certificate

active

07540079

ABSTRACT:
A circuit board-use member has a reinforcing plate, a removable organic layer, a flexible film having a circuit pattern, and a peeling-assist layer laminated in that order;a method forms a circuit board by forming a circuit pattern on a flexible film which is adhered to a reinforcing plate with a removable organic layer interposed therebetween, and peeling the film from the plate at an angle ranging from more than 0° to 80°; andan apparatus for forming a circuit board has one of a separation means for separating the flexible film from the reinforcing plate while the film contacts a curved support body;a curved separation means for separating the reinforcing plate from a support body for the flexible film while the plate is curved; or a moving means for relatively moving holding means and peeling means having a wedge-shaped member for peeling the flexible film.

REFERENCES:
patent: 2004/0026363 (2004-02-01), Akamatsu et al.
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patent: 2001-351950 (2001-12-01), None
patent: 2002-104726 (2002-04-01), None
patent: 2002-128388 (2002-05-01), None
patent: 2002-282832 (2002-10-01), None
Machine translation of JP2001-351950.

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