Laminated high-frequency low-pass filter

Wave transmission lines and networks – Coupling networks – Frequency domain filters utilizing only lumped parameters

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333204, H03H 700

Patent

active

053572270

ABSTRACT:
A laminated high-frequency low-pass filter includes a first dielectric layer. A second dielectric layer, a third dielectric layer, a fourth dielectric layer, and a fifth dielectric layer are laminated on the first dielectric layer. An earth electrode is formed on the first dielectric layer. A first capacitive open-circuited stub electrode, a second capacitive open-circuited stub electrode and a third capacitive open-circuited stub electrode are formed on the second dielectric layer. A first strip line electrode and a second strip line electrode are formed on the third dielectric layer. The first and second strip line electrodes are formed as meander lines. A shield electrode is formed on the fourth dielectric layer.

REFERENCES:
patent: 2915716 (1959-12-01), Hattersley
patent: 2945195 (1960-07-01), Matthaei
patent: 3451015 (1969-06-01), Heath
patent: 3879690 (1975-04-01), Golant et al.
patent: 5075650 (1991-12-01), Okamura et al.
patent: 5140497 (1992-08-01), Kato et al.

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