Chemistry: electrical and wave energy – Apparatus – Electrophoretic or electro-osmotic apparatus
Reexamination Certificate
2008-04-29
2008-04-29
Olsen, Kaj K. (Department: 1795)
Chemistry: electrical and wave energy
Apparatus
Electrophoretic or electro-osmotic apparatus
C156S223000, C422S105000
Reexamination Certificate
active
10198223
ABSTRACT:
A laminated flow device comprises a porous material encapsulated within bonding material. The porous material forms a flow path and the bonding material forms an enclosure surrounding the flow path. Micro-components, such as capillaries, electrodes, reservoirs, bridges, electrokinetic elements, and detectors, can be encapsulated within the device.
REFERENCES:
patent: 4240889 (1980-12-01), Yoda et al.
patent: 4999069 (1991-03-01), Brackett et al.
patent: 5037457 (1991-08-01), Goldsmith et al.
patent: 5041181 (1991-08-01), Brackett et al.
patent: 5126022 (1992-06-01), Soane et al.
patent: 5534328 (1996-07-01), Ashmead et al.
patent: 5628890 (1997-05-01), Carter et al.
patent: 5888390 (1999-03-01), Craig
patent: 5958203 (1999-09-01), Parce et al.
patent: RE36350 (1999-10-01), Swedberg
patent: 5989402 (1999-11-01), Chow et al.
patent: 5997708 (1999-12-01), Craig
patent: 6007690 (1999-12-01), Nelson et al.
patent: 6013164 (2000-01-01), Paul et al.
patent: 6019882 (2000-02-01), Paul et al.
patent: 6054034 (2000-04-01), Soane et al.
patent: 6074725 (2000-06-01), Kennedy
patent: 6080295 (2000-06-01), Parce et al.
patent: 6100107 (2000-08-01), Lei et al.
patent: 6113766 (2000-09-01), Steiner et al.
patent: 6126723 (2000-10-01), Drost et al.
patent: 6129973 (2000-10-01), Martin et al.
patent: 6150089 (2000-11-01), Schwartz
patent: 6156273 (2000-12-01), Regnier et al.
patent: 6176962 (2001-01-01), Soane et al.
patent: 6210986 (2001-04-01), Arnold et al.
patent: 6267858 (2001-07-01), Parce et al.
patent: 6287438 (2001-09-01), Knoll
patent: 6287440 (2001-09-01), Arnold et al.
patent: 6352577 (2002-03-01), Martin et al.
patent: 6418968 (2002-07-01), Pezzuto et al.
patent: 6719535 (2004-04-01), Rakestraw et al.
patent: 6729352 (2004-05-01), O'Connor et al.
patent: 6755211 (2004-06-01), O'Connor et al.
patent: 6770182 (2004-08-01), Griffiths et al.
patent: 6814859 (2004-11-01), Koehler et al.
patent: 2002/0048425 (2002-04-01), McBride et al.
patent: 2002/0056639 (2002-05-01), Lackritz et al.
patent: 2002/0059869 (2002-05-01), Martin et al.
patent: 2002/0066639 (2002-06-01), Taylor et al.
patent: 2002/0125134 (2002-09-01), Santiago et al.
patent: 2002/0166592 (2002-11-01), Liu et al.
patent: 2002/0185184 (2002-12-01), O'Connor et al.
patent: 2002/0187074 (2002-12-01), O'Connor et al.
patent: 2002/0187557 (2002-12-01), Hobbs et al.
patent: 2002/0189947 (2002-12-01), Paul et al.
patent: 2002/0195344 (2002-12-01), Neyer et al.
patent: 2003/0052007 (2003-03-01), Paul et al.
patent: 2003/0061687 (2003-04-01), Hansen et al.
patent: 2003/0116738 (2003-06-01), O'Connor et al.
patent: 2003/0143081 (2003-07-01), Rakestraw et al.
patent: 2003/0150792 (2003-08-01), Koehler et al.
patent: 2003/0198130 (2003-10-01), Karp et al.
patent: 2003/0198576 (2003-10-01), Coyne et al.
patent: 2003/0206806 (2003-11-01), Paul et al.
patent: 2003/0226754 (2003-12-01), Le Febre
patent: 2004/0011648 (2004-01-01), Paul et al.
patent: 2004/0074784 (2004-04-01), Anex et al.
patent: 2004/0087033 (2004-05-01), Schembri
patent: 2004/0101421 (2004-05-01), Kenny et al.
patent: 2004/0115731 (2004-06-01), Hansen et al.
patent: 2004/0118189 (2004-06-01), Karp et al.
patent: 2004/0129568 (2004-07-01), Seul et al.
patent: 2004/0163957 (2004-08-01), Neyer et al.
patent: 2004/0182709 (2004-09-01), Griffiths et al.
patent: 2004/0238052 (2004-12-01), Karp et al.
patent: 2004/0241004 (2004-12-01), Goodson et al.
patent: 2004/0241006 (2004-12-01), Taboryski et al.
patent: 2004/0247450 (2004-12-01), Kutchinski et al.
patent: 0421234 (1991-10-01), None
patent: 1063204 (2000-12-01), None
patent: 03-087659 (1991-04-01), None
patent: WO 99/16162 (1999-04-01), None
patent: WO 2004/027535 (1999-04-01), None
patent: WO 00/55502 (2000-09-01), None
patent: WO 01/25138 (2001-04-01), None
patent: WO 02/086332 (2002-10-01), None
US 6,406,905, 06/2002, Parce et al. (withdrawn)
J. Haisma, “Direct Bonding in Patent Literature”, Philips. J. Res. 49, pp. 165-170 (1995).
M.A. Roberts, J.S. Rossier. P. Bercier and J. Girault, “UV Laser Machined Polymer Substrates for the Development of Microdiagnostic Systems,” Anal. Chem. 69, pp. 2035-2042 (1997).
P.M. Martin, D.W. Matson, W.D. Bennett, Y.Lin and D.J. Hammerstrom, “Laminated Plastic Microfluidic Components for Biological and Chemical Systems,” J. Vac. Sci. Technol. A 17, pp. 2264-2269 (1999).
V.K. Stokes, “Joining Methods for Plastics and Plastic Composites: An Overview.” Poly. Eng. and Sci. 29 pp. 1310-1324 (1989).
N.M. Watson and M.G. Murch, “Recent Developments in Hot Plate Welding of Thermoplastics,” Poly. Eng. and Sci. 29 pp. 1382-1386 (1989).
T. Jimbo, M. Higa, N. Minoura and A. Tanioka, “Surface Characterization of Poly(acrylonitrite)Membranes: Graft-Polymerized with Ionic Monomers as Revealed by Zeta Potential Measurements,” Macromolecules 31 pp. 1277-1284 (1998).
F. Klein. “Affinity Membranes: a 10 Year Review,” J. Membrance Sci. 179 pp. 1-27 (2000).
K. Takata, Y. Yammamoto and T. Sata, “Modification of Transport Properties of Ion Exchange Membranes,” J. Membrance. Sci. 179 pp. 101-107 (2000).
S. Belfer, Y. Purinson, R. Fainshtein, Y. Radchenko and O. Kedem, “Surface Modification of Commercial Polyamide Reverse Osmosis Membranes,” J. Membrane Sci. 139 pp. 175-181 (1998).
A. Mroz, M. Borchardt, C. Diekmann, K. Cammann, M. Knoll, and C. Dumschat. “Disposable Reference Electrode,” Analyst 123 pp. 1373-1376 (1998).
PCT Search Report dated Mar. 25, 2004.
Jack R. Vinson,Adhesive Bonding of Polymer Composites, Polymer Engineering and Science, Mid-Oct. 1989, vol. 29, No. 19, pp. 1325-1331.
Holger Becker; Claudia Gartner,Polymer microfabrication methods for microfluidic analytical applications, Electrophoresis 2000, 21, 12-26.
M. Gongora-Rubio, et al.The utilization of low temperature co-fired ceramics(LTCC-ML)technology for meso-scale EMS, a simple thermistor based flow sensor, Sensors and Actuators 73 (1999) 215-221.
Neyer David W.
Paul Phillip H.
Rehm Jason E.
Eksigent Technologies LLC
Sheldon Jeffrey G.
Sheldon Mak Rose & Anderson
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