Laminated electronic component and method for producing the...

Details Laminated electronic component and method for producing the... Laminated electronic component and method for producing the...

2005-01-06

2008-11-04

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S261000

Reexamination Certificate

active

07446262

ABSTRACT:
A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.

REFERENCES:
patent: 5943212 (1999-08-01), Horiuchi et al.
patent: 6259157 (2001-07-01), Sakamoto et al.
patent: 6815810 (2004-11-01), Takehara et al.
patent: 6818979 (2004-11-01), Takehara et al.
patent: 6938332 (2005-09-01), Harada et al.
patent: 7042087 (2006-05-01), Sakamoto et al.
patent: 2003/0071350 (2003-04-01), Takehara et al.
patent: 2003/0141105 (2003-07-01), Sugaya et al.
patent: 2005/0040522 (2005-02-01), Hideki et al.
patent: 1395464 (2003-02-01), None
patent: 1412838 (2003-04-01), None
patent: 53-84681 (1978-07-01), None
patent: 10-264130 (1998-10-01), None
patent: 11-265964 (1999-09-01), None
patent: 2001-244638 (2001-09-01), None
patent: 2002-110716 (2002-04-01), None
patent: 2003-007367 (2003-01-01), None
patent: 2003-124435 (2003-04-01), None
Official communication issued in the counterpart Chinese Application No. 2005800000975, mailed on Jun. 22, 2007.

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