Laminated diamond substrate

Details Laminated diamond substrate Laminated diamond substrate

1993-05-24

1995-08-15

Turner, A. A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Including variation in thickness

428156, 428216, 428323, 428408, 428142, H01L 2158

Patent

active

054417910

ABSTRACT:
A synthetic diamond wafer grown by deposition from a plasma has a smooth, substrate side face and a rough, deposition side face. The rough face is coated with a bonding agent which fills the valleys and is finished so that its surface is parallel to the substrate side face to permit photolithographic processing of the wafer. Also disclosed is a multi-wafer laminate of two or more diamond film layers bonded together with an interlayer. Smooth, flat outer faces of the layers are oriented mutually parallel. The inner, bonded faces may be rough. A filler of diamond particles in the bonding agent improves the thermal conductivity of the laminate.

REFERENCES:
Ravi et al "Silicon on Insulator Technology Using CVD Diamond Films" Electrochemical Soc, LA, Calif. May, 1989.

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