Laminated device

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil

Reexamination Certificate

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Details

C336S223000, C336S232000, C336S233000, C336S234000, C428S692100, C252S062600, C252S062620

Reexamination Certificate

active

08004381

ABSTRACT:
A laminated device comprising pluralities of magnetic ferrite layers, conductor patterns each formed on each magnetic ferrite layer and connected in a lamination direction to form a coil, and a non-magnetic ceramic layer formed on at least one magnetic ferrite layer such that it overlaps the conductor patterns in a lamination direction, the non-magnetic ceramic layer comprising as main components non-magnetic ceramics having higher sintering temperatures than that of the magnetic ferrite, and further one or more of Cu, Zn and Bi in the form of an oxide.

REFERENCES:
patent: 5476728 (1995-12-01), Nakano et al.
patent: 6489877 (2002-12-01), Yamamoto et al.
patent: 6826031 (2004-11-01), Nagai et al.
patent: 6917274 (2005-07-01), Hong et al.
patent: 2001/0032383 (2001-10-01), Haratani et al.
patent: 2004/0046631 (2004-03-01), Sakakura et al.
patent: 2004/0108934 (2004-06-01), Choi et al.
patent: 56-155516 (1981-12-01), None
patent: 03-097211 (1991-04-01), None
patent: 06-077022 (1994-03-01), None
patent: 06-224043 (1994-08-01), None
patent: 08-064421 (1996-03-01), None
patent: 2005-268455 (2005-09-01), None
patent: 2007/088914 (2007-08-01), None
Chinese Office Action dated Dec. 6, 2010.

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