Laminated cylindrical backplane

Details Laminated cylindrical backplane Laminated cylindrical backplane

1994-12-22

1996-05-21

Thomas, Laura

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361788, 361790, 361784, 439 59, 439 61, 439 62, 174261, H05K 114

Patent

active

055195849

ABSTRACT:
A laminated cylindrical backplane is constructed using disks with a conductive material mounted on a top surface, and a conductive material mounted on a second surface. Each disk and its conductive surfaces are separated from adjacent disks and their conductive surfaces by a dielectric material. The laminated structure forms a cylindrical backplane where circuit cards are radially mounted to the backplane by inserting the cards into slots in the perimeter of the cylindrical structure. The slots contain contacts where similarly positioned contacts of a particular disk are electrically connected to form a bus structure. As a result, similarly positioned conductive surfaces on circuit cards are electrically connected when the cards are inserted into the slots.

REFERENCES:
patent: 4679872 (1987-07-01), Coe
patent: 5119273 (1992-06-01), Corda
patent: 5301089 (1994-04-01), Takashima
patent: 5319526 (1994-06-01), Takashima
patent: 5341509 (1994-08-01), Takashima

Affiliated with

Also associated with

Rating

Laminated cylindrical backplane does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laminated cylindrical backplane, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminated cylindrical backplane will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2043479