Laminated circuit board and its manufacturing method, and...

Details Laminated circuit board and its manufacturing method, and... Laminated circuit board and its manufacturing method, and...

2008-01-08

2008-01-08

Duverne, J. F. (Department: 2839)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

Reexamination Certificate

active

10991682

ABSTRACT:
A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.

REFERENCES:
patent: 6380614 (2002-04-01), Higuchi et al.
patent: 6882545 (2005-04-01), Akita et al.
patent: 2003-86949 (2003-03-01), None

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