Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-01-08
2008-01-08
Duverne, J. F. (Department: 2839)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
Reexamination Certificate
active
07317621
ABSTRACT:
A laminated circuit board with electronic components buried therein comprises a substrate on which a land disposed on one main surface thereof is connected and fixed by solder to an integrated circuit (or the like). A sheet is laminated on the upper surface of the substrate. A filling portion by fluid resin is formed by clearance at the outer periphery of the integrated circuit (or the like). The sheet maintains its shape by woven or non-woven cloth having a hole in which the integrated circuit (or the like) is buried. The woven or non-woven cloth is impregnated with resin having heat fluidity and is thermally compressed. Thus, the electrical and mechanical connections between the laminated circuit board and electronic component can be enhanced in reliability.
REFERENCES:
patent: 6380614 (2002-04-01), Higuchi et al.
patent: 6882545 (2005-04-01), Akita et al.
patent: 2003-86949 (2003-03-01), None
Harada Shinji
Kimura Jun-ichi
Nishii Toshihiro
Ochi Akio
Duverne J. F.
Matsushita Electric - Industrial Co., Ltd.
RatnerPrestia
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