Laminated circuit board

Details Laminated circuit board Laminated circuit board

2011-07-12

2011-07-12

Lam, Cathy (Department: 1784)

Stock material or miscellaneous articles

All metal or with adjacent metals

Macroscopically anomalous interface between layers

C428S209000, C428S607000, C174S250000, C174S264000, C205S111000, C205S125000, C029S829000, C029S831000

Reexamination Certificate

active

07976956

ABSTRACT:
A through-hole type laminated circuit board is given with high reliability of electrical connection using copper foil and conductive paste containing low melting point metal without generating harmful void and crack at boundary between the copper foil and conductive paste metal. The laminated circuit board is made by laminating a multiple number of resin boards with roughening treated copper foils at least on their one surface sides with roughening projection deposition of less than 150 mg/dm2to make surface roughness Rz of 0.3 to 10 μm and height of the projection to be 0.3 to 10 μm. Surface roughness of the original foil is 0.1 to 5 μm and the amount of copper metal atoms of roughening treated layer is set at 4 times or less than the amount of diffusible conductive paste metal atoms containing low melting point metal into the roughening treated layer on the foil surface.

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