Laminated ceramic electronic component having via-hole...

Details Laminated ceramic electronic component having via-hole... Laminated ceramic electronic component having via-hole...

2005-12-13

2005-12-13

Pert, Evan (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S263000, C174S264000, C174S265000, C361S793000, C361S795000

Reexamination Certificate

active

06974916

ABSTRACT:
In a laminated ceramic electronic component, the sectional size of via-hole conductors extending through thicker ceramic layers is larger than that of via-hole conductors extending through thinner ceramic layers. This makes it possible to facilitate filling of a conductive paste for the via-hole conductors having a larger height and to inhibit a conductive paste for the via-hole conductors having a smaller height from being lost after filling.

REFERENCES:
patent: 3726002 (1973-04-01), Greenstein et al.
patent: 3922479 (1975-11-01), Older et al.
patent: 4739448 (1988-04-01), Rowe et al.
patent: 5061824 (1991-10-01), Alexander et al.
patent: 5375042 (1994-12-01), Arima et al.
patent: 5408053 (1995-04-01), Young
patent: 5451721 (1995-09-01), Tsukada et al.
patent: 5627406 (1997-05-01), Pace
patent: 5719749 (1998-02-01), Stopperan
patent: 6118671 (2000-09-01), Tanei et al.
patent: 6320140 (2001-11-01), Enomoto
patent: 6329610 (2001-12-01), Takubo et al.
patent: 61-148847 (1986-07-01), None
patent: 02-137295 (1990-05-01), None
patent: 02-148889 (1990-06-01), None
patent: 06-268369 (1994-09-01), None
patent: 08-023168 (1996-01-01), None

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