Laminated bonding structure of thin plate members and inkjet...

Details Laminated bonding structure of thin plate members and inkjet... Laminated bonding structure of thin plate members and inkjet...

2007-04-03

2007-04-03

Shah, Manish S. (Department: 2861)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S068000

Reexamination Certificate

active

10879024

ABSTRACT:
A laminated bonding structure of thin plate members includes; a plurality of thin plate members laminated through an adhesive agent, the plurality of thin plate members including at least one thin plate member having a plurality of holes formed therein; and a hole group encircling groove that encircles a hole group constituted by at least part of the plurality of holes is formed on the thin plate member having the plurality of holes.

REFERENCES:
patent: 5779837 (1998-07-01), Harvey
patent: 6290340 (2001-09-01), Kitahara et al.
patent: 6361155 (2002-03-01), Kanda et al.
patent: 6536879 (2003-03-01), Ito et al.
patent: 2002/0036678 (2002-03-01), Ito et al.
patent: 2003/0048328 (2003-03-01), Inamoto et al.
patent: 1 293 343 (2003-03-01), None
patent: A 57-093163 (1982-06-01), None
patent: A 10-157150 (1998-06-01), None
patent: A 2002-96477 (2002-04-01), None
patent: A-2002-096478 (2002-04-01), None
patent: A-2002-240272 (2002-08-01), None

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