Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2010-04-28
2011-11-15
Ha, Nathan (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23079
Reexamination Certificate
active
08058717
ABSTRACT:
A semiconductor chip laminated body includes a wiring board having a connecting terminal; a plurality of semiconductor chips laminated on the wiring board, each of the semiconductor chips having a pad; conductive connecting members having first end parts connected to the pads of the corresponding semiconductor chips and second end parts projecting from side surfaces of the corresponding semiconductor chips; and a conductive member configured to connect the connecting terminal of the wiring board and the second end parts of the conductive connecting members; wherein conductive materials are exposed at the side surfaces of the semiconductor chips; and a gap is provided between the side surfaces of the semiconductor chips and the conductive member.
REFERENCES:
patent: 5675180 (1997-10-01), Pedersen et al.
patent: 6522022 (2003-02-01), Murayama
patent: 6628527 (2003-09-01), Muramatsu et al.
patent: 7589410 (2009-09-01), Kim
patent: 7759785 (2010-07-01), Corisis et al.
patent: 7768795 (2010-08-01), Sakurai et al.
patent: 7772689 (2010-08-01), Kobayashi et al.
patent: 7777349 (2010-08-01), Murayama et al.
patent: 7843059 (2010-11-01), Gomyo et al.
patent: 2005/0230802 (2005-10-01), Vindasius et al.
patent: 2007/0284716 (2007-12-01), Vindasius et al.
patent: 2008/0111225 (2008-05-01), Kim et al.
patent: 2008/0224298 (2008-09-01), Corisis et al.
patent: 2009/0020887 (2009-01-01), Mizuno et al.
patent: 2009/0020889 (2009-01-01), Murayama et al.
patent: 2009/0023247 (2009-01-01), Mizuno et al.
patent: 2009/0146283 (2009-06-01), Chen et al.
patent: 2009/0146284 (2009-06-01), Kim et al.
patent: 2009/0179318 (2009-07-01), Chen
patent: 2009/0206464 (2009-08-01), Chung et al.
patent: 2009/0230533 (2009-09-01), Hoshino et al.
patent: 2010/0320585 (2010-12-01), Jiang et al.
patent: 2000-340694 (2000-12-01), None
patent: 3895768 (2007-03-01), None
Ha Nathan
IPUSA, PLLC
Shinko Electric Industries Co. Ltd.
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