Laminated body and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S508000, C257S758000, C257SE21579

Reexamination Certificate

active

07608928

ABSTRACT:
A laminate includes a copper wiring layer (20) provided over a semiconductor layer and having a specific pattern, a protective layer (30) formed of a polybenzoxazole resin layer provided on the copper wiring layer (20), and an insulating layer (40) provided on the protective layer.

REFERENCES:
patent: 5602060 (1997-02-01), Kobayashi et al.
patent: 6204565 (2001-03-01), Shimoto et al.
patent: 6518390 (2003-02-01), Okanuma et al.
patent: 7022582 (2006-04-01), Sezi
patent: 2001/0004539 (2001-06-01), Kirchhoff et al.
patent: 2003/0067077 (2003-04-01), Lee
patent: 2003/0134950 (2003-07-01), Kudo et al.
patent: 2003/0219973 (2003-11-01), Townsend et al.
patent: 2004/0119164 (2004-06-01), Kurashima et al.
patent: 5 205526 (1993-08-01), None
patent: 11 228674 (1999-08-01), None
patent: 11 349683 (1999-12-01), None
patent: 2000 31137 (2000-01-01), None
patent: 2000 191752 (2000-07-01), None
patent: 2001 335748 (2001-12-01), None
patent: 2001 354904 (2001-12-01), None
patent: 2002 20689 (2002-01-01), None
patent: 2002 151500 (2002-05-01), None
patent: 2002 167442 (2002-06-01), None
patent: 2002 222860 (2002-08-01), None
patent: 2002 299441 (2002-10-01), None
patent: 2003 110018 (2003-04-01), None

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