Laminated board and process for production thereof

Fabric (woven – knitted – or nonwoven textile or cloth – etc.) – Coated or impregnated woven – knit – or nonwoven fabric which... – Coated or impregnated inorganic fiber fabric

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442180, 442275, 442278, 442281, 442284, 442295, 442391, 442393, 442412, 428 345, 428 346, 428 347, 428206, 428207, 428209, 428221, 4283014, 428901, B32B 2738

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active

061242209

ABSTRACT:
A laminated board comprising an intermediate layer and two surface layers formed thereon, in which board the intermediate layer comprises a central layer made of a nonwoven glass fiber fabric impregnated with a resin composition containing a thermosetting resin and an inorganic filler and upper and lower layers formed on the central layer, each being made of said resin composition containing a thermosetting resin and an inorganic filler, and the two surface layers formed on the intermediate layer are made of a thermosetting resin-impregnated fiber substrate; and a process for production of the laminated board.

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"Laminated Board for Printed Circuits", Yozo Shioda et al., Japanese Patent Application 06302926.
Sumitomo Bakelite Co Ltd., Production of Laminate for Printed Circuit, Patent Abstracts of Japan, 095:010, Nov. 30, 1995.
Sumitomo Bakelite Co Ltd., Laminated Board for Printed Circuit, Patent Abstracts of Japan, 013:414, Sep. 13, 1989.
Sumitomo Bakelite Co Ltd., Multilayer Board Produce Print Circuit Forming Board Surface Glass Woven Cloth Impregnate Polyepoxide Resin Intermediate Layer Glass Cloth Impregnate Polye.sub.p oxide Resin Inorganic Fill, Derwent Publications Ltd., JP4215492, Aug. 6, 1992.

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