Laminate type materials for flexible circuits or...

Stock material or miscellaneous articles – Composite – Of metal

Reexamination Certificate

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C428S473500, C428S910000

Reexamination Certificate

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06916544

ABSTRACT:
A laminate having improved resistance to separation failure when incorporated into a flexible circuit structure. The laminate comprising a highly bondable polyimide and is preferably formed from a polyamic acid comprising a tetracarboxylic acid component, a diamine component, and 0.1 to 5.0 mole % of a dicarboxylic acid component, with respect to the tetracarboxylic acid component, and wherein the adhesive strength of the laminate is greater than 10 N/cm, and more preferably greater than 19 N/cm.

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patent: 5502157 (1996-03-01), Chang et al.
patent: 5700562 (1997-12-01), Sugimoto et al.
patent: 5741585 (1998-04-01), Harris et al.
patent: 6274699 (2001-08-01), Meador
patent: 6303744 (2001-10-01), Meador et al.
patent: 6605366 (2003-08-01), Yamaguchi et al.

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