Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-11-01
2005-11-01
Mayes, Melvin (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S089160, C156S089180, C361S321300, C361S321400, C428S210000
Reexamination Certificate
active
06960271
ABSTRACT:
A laminate type dielectric device is formed by alternately laminating dielectric ceramic layers and electrode layers and integrally baking the laminate product. The electode layers are mainly made of an electrically conductive base metal material having greater standard Gibbs free energy for the formation of a metal oxide at a baking temperature than that of the ceramic material constituting the dielectric ceramic layers. Segregation of the materials including the electrically conductive base metal material does not occur at portions sandwiched between adjacent positive and negative electrode layers among the dielectric ceramic layers.
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Nagaya Toshiatsu
Shindo Hitoshi
Sumiya Atsuhiro
Yamamoto Takashi
Yasuda Etsuro
Denso Corporation
Mayes Melvin
Nippon Soken Inc.
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