Laminate product of ultra thin copper film on a flexible aluminu

Details Laminate product of ultra thin copper film on a flexible aluminu Laminate product of ultra thin copper film on a flexible aluminu

1983-05-27

1984-02-14

O'Keefe, Veronica

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428606, 428607, 428620, 428629, 428632, 428652, 428674, B32B 1520

Patent

active

044317107

ABSTRACT:
A copper-clad laminate having special utility in the production of high resolution printed circuit patterns is made by a method which includes as the step of forming an initial copper film by vapor depositing copper directly in contact with an as-rolled aluminum carrier sheet at temperature between about 100.degree. C. and 250.degree. C. so that the carrier release peel strength has an average value between about 0.5 and 2.0 pounds per inch.

REFERENCES:
patent: 3969199 (1976-07-01), Berdan et al.
patent: 3984598 (1976-10-01), Sarazin et al.
patent: 4193849 (1980-03-01), Sato
patent: 4357395 (1982-11-01), Lifshin et al.
patent: 4383003 (1983-05-01), Lifshin et al.
Pellegrino News Item (Electronics Packaging and Production, vol. 18, No. 11, p. 125, Nov. 1978).
"Advantages of Thin Copper Foils for the Manufacture of Printed Circuit Boards", D. E. L. Dyke and T. I. Murphy, Insulation/Circuits, Mar. 1979, pp. 11-16.

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