Laminate organic resin wiring board and method of producing the

Details Laminate organic resin wiring board and method of producing the Laminate organic resin wiring board and method of producing the

1996-06-12

1999-06-01

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174266, H05K 114

Patent

active

059090090

ABSTRACT:
A laminate organic resin wiring board and a method of producing the same are disclosed. The wiring board has a plurality of subassemblies each having a conductive resin layer serving as a ground or feed layer on its top. The subassemblies are adhered to each other at their conductive resin layers. This successfully eliminates the need for an organic resin layer for insulation customarily formed on the top of the individual subassembly. The decrease in the number of layers reduces the period of time necessary for the production of the wiring board.

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patent: 5534666 (1996-07-01), Ishida
patent: 5590461 (1997-01-01), Ishida

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