Laminate for printed circuit boards

Details Laminate for printed circuit boards Laminate for printed circuit boards

2006-06-20

2006-06-20

Bos, Steven (Department: 1754)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S328000, C428S329000, C156S307400, C442S060000, C442S065000, C442S070000, C442S172000, C442S175000, C442S180000

Reexamination Certificate

active

07063883

ABSTRACT:
Laminates for printed circuit boards having surface layers of curable resin impregnated woven glass fabric and intermediate layers of curable resin impregnated non-woven glass. The intermediate layers contain 200 percent by weight to 275 percent by weight, based on the resin in the intermediate layers, of a thermally stable aluminum hydroxide of the molecular formula Al2O3.nH2O, wherein n has a value of 2.6<n<2.9. The aluminum hydroxide has a specific surface area, measured by the BET method, of 2 to 10 m2/g and a particle size in the D50% range of 5 to 10 μm.

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Amer. Chem. Soc., Washington, D.C.
Patent Abstracts of Japan, vol. 17, No. 13, (E-1304), (Jan. 11, 1993).
Derwent Publications Ltd., Database WPI, Section Ch, Week 8547, AN 85-293904.
Derwent Publications Ltd., Database WPI, Section Ch, Week 7640, AN 76-74517X.

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