Laminate for electronic materials

Details Laminate for electronic materials Laminate for electronic materials

2006-07-04

2006-07-04

Tran, Thao T. (Department: 1711)

Stock material or miscellaneous articles

Composite

Of polyimide

C528S353000, C528S332000, C528S350000

Reexamination Certificate

active

07070864

ABSTRACT:
This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol % or more of 4,4′-diamino-2,2′-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol % or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bis[4-(4-aminophenoxy)phenyl]propane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.

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International Search Report for PCT/JP02/03919 mailed on Jul. 30, 2002.
International Preliminary Examination Report for PCT/JP02/03919 mailed on Jul. 1, 2003.

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