Laminate for electronic circuit

Details Laminate for electronic circuit Laminate for electronic circuit

2007-02-13

2007-02-13

Aftergut, Jeff H. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S299000, C428S458000

Reexamination Certificate

active

10765086

ABSTRACT:
The present invention is directed to a laminate having a layer construction of metal-insulating layer-metal or a layer construction of metal-insulating layer, which laminate meets conditions for developing large adhesive strength between the insulating layer and the metal, as well as to an insulating film and an electronic circuit using the laminate. The laminate has a layer construction of first metal layer/insulating layer/second metal layer or a layer construction of metal layer/insulating layer. The insulating layer1has a multilayer structure of two or more layers. The layers on the side of the adhesive interface with each metal layer (a copper foil3and an SUS foil4), out of the layers constituting the insulating layer1, each are a thermoplastic resin layer2. The minimum value of the storage modulus at a temperature at or above Tg of the thermoplastic resin layer2is not more than 106Pa.

REFERENCES:
patent: 5741598 (1998-04-01), Shiotani et al.
patent: 605112 (1994-07-01), None
patent: 60102630 (1985-06-01), None
English abstract for JP60102630.

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