Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil
Reexamination Certificate
2011-03-15
2011-03-15
Mai, Anh T (Department: 2832)
Inductor devices
Coil or coil turn supports or spacers
Printed circuit-type coil
C336S223000, C336S232000
Reexamination Certificate
active
07907044
ABSTRACT:
The laminate device of the present invention comprises magnetic layers and coil patterns alternately laminated, the coil patterns being connected in a lamination direction to form a coil, and pluralities of magnetic gap layers being disposed in regions in contact with the coil patterns.
REFERENCES:
patent: 5206620 (1993-04-01), Watanabe et al.
patent: 5469399 (1995-11-01), Sato et al.
patent: 5572478 (1996-11-01), Sato et al.
patent: 6459351 (2002-10-01), Maki et al.
patent: 6504466 (2003-01-01), Katsurada
patent: 6515568 (2003-02-01), Maki et al.
patent: 7380328 (2008-06-01), Ahn et al.
patent: 2002/0140539 (2002-10-01), Takashima et al.
patent: 2003/0068998 (2003-04-01), Yamakawa et al.
patent: 2004/0032706 (2004-02-01), Kemmochi et al.
patent: 2004/0207488 (2004-10-01), Kono et al.
patent: 2006/0152325 (2006-07-01), Nakao et al.
patent: 2007/0182519 (2007-08-01), Tsuzuki et al.
patent: 2007/0230221 (2007-10-01), Lim et al.
patent: 1282969 (2001-02-01), None
patent: 02-165607 (1990-06-01), None
patent: 06-224043 (1994-08-01), None
patent: 07-021791 (1995-01-01), None
patent: 2001-044037 (2001-02-01), None
patent: 2003-158467 (2003-05-01), None
patent: 2003-347124 (2003-12-01), None
patent: 2004-343084 (2004-12-01), None
patent: 2005-045108 (2005-02-01), None
patent: 2005045108 (2005-02-01), None
patent: 2005-053759 (2005-03-01), None
patent: 2005-150168 (2005-06-01), None
patent: 2005-268455 (2005-09-01), None
patent: 2006-216916 (2006-08-01), None
patent: 2005032226 (2005-04-01), None
Miyoshi Yasuharu
Tada Tomoyuki
Umeno Toru
Hitachi Metals Ltd.
Mai Anh T
Sughrue & Mion, PLLC
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