Laminate damping base material, and damping structure with...

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Noninterengaged fiber-containing paper-free web or sheet...

Reexamination Certificate

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C428S299100, C428S299400, C428S300400, C428S300700, C428S301100

Reexamination Certificate

active

10491247

ABSTRACT:
A damping structure which dispenses of the connection of a resistor used for a conventional damping structure and undergoes diverse molding processings with a simpler structure, and a laminate damping base material constituting such a damping structure. A laminate damping base material made of a piezoelectric ceramic material or piezoelectric polymer material and a conductive fiber-reinforced plastic (FRP) composition is prepared. One to a plurality of this base material are stacked to constitute a first damping structure. A second damping structure is constituted by stacking at least a layer of piezoelectric polymer film or piezoelectric ceramic thin film between a multilayer laminate that is a laminate of conductive laminate FRP base materials.

REFERENCES:
patent: 5955822 (1999-09-01), Schutze et al.
patent: 6703766 (2004-03-01), Duerr
patent: 19712292 (1998-01-01), None
patent: 2323654 (1998-09-01), None
patent: 06085346 (1994-03-01), None
patent: 07284198 (1995-10-01), None
patent: 9-216958 (1997-08-01), None
patent: 10-132021 (1998-05-01), None
Toshio Tanimoto, “Vibration Suppression in Fiber-Reinforced Plastics,” Mar. 25, 1998, pp. 1-12, Shonan Institute of Technology, Tsuijdo-Nishikaigan, Fujisawa, Kanagawa 251-8511, Japan.

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