Laminate comprising polyimide and conductor layer,...

Details Laminate comprising polyimide and conductor layer,... Laminate comprising polyimide and conductor layer,...

2001-02-14

2010-02-16

Talbot, Brian K (Department: 1792)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S523000, C427S585000, C427S383100, C204S192100

Reexamination Certificate

active

07662429

ABSTRACT:
A laminate comprising a polyimide and a conductor layer, which is obtained by forming at least one conductor layer directly on the surface of a thermoplastic polyimide, is thermally fused by pressurizing and heating to thereby enhance the adhesion strength between the thermoplastic polyimide and the conductor layer. Thus, a laminate having an excellent adhesion strength between a conductor layer and a polyimide film can be obtained without performing any surface roughening treatment or using any adhesive metal layer.

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patent: 54-066966 (1979-05-01), None
patent: 60640 (1987-03-01), None
patent: 11-240106 (1999-09-01), None

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