Laminate ceramic circuit board and process therefor

Details Laminate ceramic circuit board and process therefor Laminate ceramic circuit board and process therefor

2008-01-22

2008-01-22

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S252000, C174S262000

Reexamination Certificate

active

10709209

ABSTRACT:
A circuit board assembly that makes use of a low-temperature co-fired ceramic (LTCC) substrate, and a process for producing the assembly. The substrate contains at least first and second regions formed by a plurality of first ceramic layers and at least one second ceramic layer, respectively, that are superimposed and bonded to each other. Conductor lines are present on at least some of the first ceramic layers so as to be between adjacent pairs of the layers. Electrically-conductive vias electrically interconnect the conductor lines on different first ceramic layers, and a surface-mount IC device is mounted to the substrate. The first ceramic layers are formed of electrically-nonconductive materials, while the one or more second ceramic layers contain thermally-conductive particles dispersed in a matrix of electrically-non-conductive materials, such that the one or more second ceramic layers are more thermally conductive than the first ceramic layers.

REFERENCES:
patent: 5347091 (1994-09-01), Schroeder
patent: 5386339 (1995-01-01), Polinski, Sr.
patent: 5998043 (1999-12-01), Sasaki et al.
patent: 6518502 (2003-02-01), Hammond et al.
patent: 6690583 (2004-02-01), Bergstedt et al.
patent: 6794747 (2004-09-01), Takehara et al.
patent: 6818979 (2004-11-01), Takehara et al.
patent: 6911728 (2005-06-01), Ishikawa et al.
patent: 1 394 857 (2004-03-01), None
patent: 02 177589 (1990-07-01), None
European Search Report dated Jun. 17, 2005.

Affiliated with

Also associated with

Rating

Laminate ceramic circuit board and process therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laminate ceramic circuit board and process therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminate ceramic circuit board and process therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3936835