Laminate board containing uniformly distributed filler particles

Details Laminate board containing uniformly distributed filler particles Laminate board containing uniformly distributed filler particles

1987-01-20

1989-01-17

Thibodeau, Paul J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428286, 428325, 428336, 4283137, 4283139, 428402, 428460, 428461, 428901, B32B 1504, B32B 500

Patent

active

047987626

ABSTRACT:
A copper clad laminate board for a printed circuit has a center plate which is a thermosetting resin containing hollow glass microspheres uniformly distributed in the resin. The center plate has sheets provided on both sides thereof, which sheets are a thermosetting resin having a reinforcing fabric. The board has a high electrical resistance and resists bending during subsequent processing.

REFERENCES:
patent: 4013810 (1977-03-01), Long
patent: 4241132 (1980-12-01), Pratt et al.
patent: 4250136 (1981-02-01), Rex
patent: 4520067 (1985-05-01), Harris et al.
patent: 4547408 (1985-10-01), Cassat et al.
Search Report from EP 85 11 0227.

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