Laminate and process for producing the same

Details Laminate and process for producing the same Laminate and process for producing the same

2008-03-04

2008-03-04

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Composite

Of polyimide

C428S209000, C428S212000, C428S213000, C428S214000, C428S458000, C156S308200, C156S309900

Reexamination Certificate

active

10467463

ABSTRACT:
This invention relates to a laminate comprising an insulating polyimide resin layer etchable by an aqueous alkaline solution and a metal foil. The laminate has an insulating resin layer composed of a plurality of polyimide resin layers on the metal foil and the insulating resin layer has at least one polyimide resin layer (A) with a coefficient of linear thermal expansion (CTE) of 30×10−6/° C. or less and at least one polyimide resin layer (B) with a glass transition temperature (Tg) of 300° C. or below, the layer in contact with the metal foil is the polyimide resin layer (B), the bonding strength between the metal foil and the polyimide resin layer (B) in contact therewith is 0.5 kN/m or more, and the average rate of etching of the insulating resin layer by a 50 wt % aqueous solution of potassium hydroxide at 80° C. is 0.5 μm/min or more. The laminate is useful for flexible printed circuits and the like.

REFERENCES:
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International Search Report for PCT/JP02/01317 mailed on May 28, 2002.
Notification of Transmittal of Copies of Translation of the International Preliminary Examination Report for PCT/JP02/01317 mailed on Dec. 10, 2003.

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