Laminate and process for producing the same

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Polymers from only ethylenic monomers or processes of...

Reexamination Certificate

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C526S317100, C526S347000

Reexamination Certificate

active

06998455

ABSTRACT:
This invention relates to a laminate which changes in dimension to such a small extent as not to cause curling and warpage when the ambient humidity changes and is useful for flexible printed wiring boards. The laminate possesses a polyimide layer or layers of polyimides formed on a conductor by coating and at least one of the polyimide layers is composed of polyimide of low hygroscopic expansion obtained by the reaction of diamines containing 20 mol % or more of 4,4′-diamino-2,2′-dimethylbiphenyl with a tetracarboxylic acid compound and exhibiting a coefficient of linear hygroscopic expansion of 15×10−6/% RH or less.

REFERENCES:
patent: 60-243120 (1985-12-01), None
patent: 61-111181 (1986-05-01), None
patent: 61-143434 (1986-07-01), None
patent: 3-123093 (1991-05-01), None
patent: 3-104185 (1991-07-01), None
patent: 3-164240 (1991-07-01), None
patent: 03-164240 (1991-07-01), None
patent: 4-144741 (1992-05-01), None
patent: 04-144741 (1992-05-01), None
patent: 06-93537 (1994-11-01), None
patent: 10-126019 (1998-05-01), None
patent: 10-298286 (1998-11-01), None
patent: 11-054862 (1999-02-01), None
International Search Report PCT/JP00/07330 mailed on Jan. 23, 2001.

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