Laminate, a substrate with wires, an organic EL display...

Details Laminate, a substrate with wires, an organic EL display... Laminate, a substrate with wires, an organic EL display...

2007-01-30

2007-01-30

Garrett, Dawn (Department: 1774)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C428S690000, C428S917000, C427S066000, C313S504000, C313S506000

Reexamination Certificate

active

10682719

ABSTRACT:
A laminate for forming a substrate with wires, comprising a conductive layer containing Al or an Al alloy as the major component, formed on a substrate and a capping layer containing a Ni—Mo alloy as the major component, formed on the conductive layer, a substrate with wires produced by etching the laminate to remove an unnecessary metal, and a method for producing the same.

REFERENCES:
patent: 4401529 (1983-08-01), Gray
patent: 5820996 (1998-10-01), Hirai et al.
patent: 6008869 (1999-12-01), Oana et al.
patent: 6307317 (2001-10-01), Codama et al.
patent: 2002/0011783 (2002-01-01), Hosokawa
patent: 11-317292 (1999-11-01), None
patent: 11-329750 (1999-11-01), None
patent: 2001-311954 (2001-11-01), None
patent: 2001-351778 (2001-12-01), None
JP 74040384 B, published Nov. 1, 1974, DERWENT abstract.
C. W. Tang, et al., “Organic electroluminescent diodes”, Appl. Phys. Lett., vol. 51, No. 12, Sep. 21, 1987, pp. 913-915.
Kiyotake Naraoka, et al., “Photoetching and Microfabrication”, Sogo Denshi Shuppansha, May 10, 1997, pp. 82-83 (with partial English translation).

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