Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-01-10
1996-06-04
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
174252, H05K 720
Patent
active
055239196
ABSTRACT:
A laminar board for printed circuits is described, consisting of a base layer (1) made of a material with a high coefficient of thermal conduction and, on at least one side (1B) of the base layer, a coating (13) of electrically insulating material forming the surface for the application of the conducting tracks (11) of the printed circuit. The base layer (1) has at least one deformed area with a depression (3A) on one side (1A) and a corresponding projection (3B) on the opposite side (1B), the insulating coating (13) being applied to the side (1B) on which the projection (3B) is disposed, forming a surface substantially free of discontinuities, with a lesser thickness at the position of the projection (3B) and a greater thickness in the areas adjacent to the projection; the power components (15) of the circuit are fitted over the projection (3B).
REFERENCES:
patent: 3165672 (1965-01-01), Gellert
patent: 5220487 (1993-06-01), Patel et al.
"Heat Transfer Improvement for Thermal Carrier Circuit Cards" IBM Technical Disclosure Bulletin, p. 498, 1992.
Magnetek S.p.A.
Thompson Gregory D.
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