Laddery lower alkylpolysilsesquioxane having heat-resistant thin

Details Laddery lower alkylpolysilsesquioxane having heat-resistant thin Laddery lower alkylpolysilsesquioxane having heat-resistant thin

1982-03-02

1983-08-16

Marquis, Melvyn I.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From silicon reactant having at least one...

528 12, 528 14, 528 20, 528 21, 528 43, 556459, 556463, C08G 7700

Patent

active

043992668

ABSTRACT:
A laddery lower alkylpolysilsesquioxane represented by the formula: ##STR1## wherein R and R' represent same or different lower alkyl groups, and n represents an average degree of polymerization, said laddery lower alkylpolysilsesquioxane having a heat-resistant thin film-formability, characterized in that 15 to 30% by weight of the lower alkylpolysilsesquioxane is occupied by the portion having a standard polystyrene-reduced molecular weight of 20,000 or less as measured by gel permeation chromatography. Said silicone resin in which R and R' are methyl is prepared by dissolving CH.sub.3 SiCl.sub.3 in a ketone or an ether, adding water to this solution with stirring to hydrolyze CH.sub.3 SiCl.sub.3, condensing the hydrolyzate and, if necessary, subjecting the resulting condensate to a treatment for adjusting the proportion of the low molecular weight portion in the product.

REFERENCES:
patent: 3000858 (1951-09-01), Brown, Jr.
patent: 3017385 (1962-01-01), Sprung et al.
patent: 3234179 (1966-02-01), Katchman et al.
patent: 3318844 (1967-05-01), Krantz
patent: 3355399 (1967-11-01), Cekeda
patent: 3372133 (1968-03-01), Krantz
patent: 4273420 (1981-06-01), Watanabe et al.

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