Label with electronic components and method of making same

Details Label with electronic components and method of making same Label with electronic components and method of making same

2007-04-17

2010-11-30

Bugg, George A (Department: 2612)

Communications: electrical

Condition responsive indicating system

Specific condition

C235S375000

Reexamination Certificate

active

07843341

ABSTRACT:
A method of making an electronic label, such as an RFID label, includes attaching a circuit, such as an antenna, to a substrate material, applying an adhesive layer to the substrate material over the circuit, adding a release layer over the adhesive layer, forming at least one opening in the release layer to expose at least one portion of the circuit, and connecting a microchip to the at least one portion of the circuit through the at least one opening. The circuit can be an RFID inlay, including an antenna and a microchip, and can be formed of a conductive ink. A portion of the release layer at the at least one microchip has an opening to expose the at least one microchip so that the at least one microchip is free from coverage by the release layer.

REFERENCES:
patent: 5315753 (1994-05-01), Jensen et al.
patent: 5528222 (1996-06-01), Moskowitz et al.
patent: 5598032 (1997-01-01), Fidalgo
patent: 5654693 (1997-08-01), Cocita
patent: 5867102 (1999-02-01), Souder et al.
patent: 5950304 (1999-09-01), Khandros et al.
patent: 5955949 (1999-09-01), Cocita
patent: 5999409 (1999-12-01), Ando et al.
patent: 6036099 (2000-03-01), Leighton
patent: 6058017 (2000-05-01), Horejs et al.
patent: 6147662 (2000-11-01), Grabau et al.
patent: 6259408 (2001-07-01), Brady et al.
patent: 6262692 (2001-07-01), Babb
patent: 6265977 (2001-07-01), Vega et al.
patent: 6285977 (2001-09-01), Miyazaki
patent: 6343019 (2002-01-01), Jiang et al.
patent: 6390375 (2002-05-01), Kayanakis
patent: 6429831 (2002-08-01), Babb
patent: 6437985 (2002-08-01), Blanc et al.
patent: 6460245 (2002-10-01), DiStefano
patent: 6497371 (2002-12-01), Kayanakis et al.
patent: 6512302 (2003-01-01), Mess et al.
patent: 6522308 (2003-02-01), Mathjeu
patent: 6546620 (2003-04-01), Juskey et al.
patent: 6575374 (2003-06-01), Boyadjian et al.
patent: 6684503 (2004-02-01), Silverbrook et al.
patent: 6687986 (2004-02-01), White
patent: 6770509 (2004-08-01), Halope et al.
patent: 6786419 (2004-09-01), Kayanakis
patent: 6836215 (2004-12-01), Laurash et al.
patent: 6851617 (2005-02-01), Saint et al.
patent: 6851618 (2005-02-01), Halope
patent: 6888509 (2005-05-01), Atherton
patent: 6908786 (2005-06-01), Halope
patent: 6951596 (2005-10-01), Green
patent: 7025259 (2006-04-01), Mausy
patent: 7037556 (2006-05-01), Jaynes
patent: 2001/0002035 (2001-05-01), Kayanakis
patent: 2001/0014377 (2001-08-01), Babb et al.
patent: 2002/0036237 (2002-03-01), Atherton et al.
patent: 2003/0145945 (2003-08-01), Kennedy
patent: 2004/0040740 (2004-03-01), Nakatani et al.
patent: 2004/0061994 (2004-04-01), Kerr et al.
patent: 2004/0062016 (2004-04-01), Kerr et al.
patent: 2004/0108922 (2004-06-01), Ammar et al.
patent: 2004/0169086 (2004-09-01), Ohta et al.
patent: 2004/0215350 (2004-10-01), Roesner
patent: 2005/0035924 (2005-02-01), Liu et al.
patent: 2005/0066513 (2005-03-01), Kayanakis et al.
patent: 2005/0198811 (2005-09-01), Kurz et al.
patent: 2005/0206524 (2005-09-01), Forster et al.
patent: 2005/0275540 (2005-12-01), Halope et al.
patent: 2005/0282495 (2005-12-01), Forster
patent: 8052968 (1996-02-01), None
patent: 2003288568 (2003-10-01), None
patent: 2004118844 (2004-04-01), None
patent: 2006059373 (2006-03-01), None
patent: 2006127471 (2006-05-01), None
patent: 0026856 (2000-05-01), None
patent: 2004088582 (2004-10-01), None
patent: 2005057483 (2005-06-01), None
Supplementary European Search Report issued in corresponding EP Application No. 06 73 7948 dated Mar. 5, 2010.

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