Label system for making integrated circuit diagrams and printed

Details Label system for making integrated circuit diagrams and printed Label system for making integrated circuit diagrams and printed

1980-08-19

1981-12-15

Bell, James J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 63, 156249, 156300, 156DIG19, B32B 3100

Patent

active

043057675

ABSTRACT:
Gummed labels having outlines corresponding to top and bottom views of integrated circuit packages include numbered lead locations as seen from both the top and bottom of a particular integrated circuit package. A simplified schematic diagram located on the portion of a label corresponding to the integrated circuit package body indicates connection of an integrated circuit to the respective leads. Part numbers and brief descriptions and commercial integrated circuits are printed on the labels. A plurality of unused labels are removably attached to a backing sheet, and are peeled off and placed on a working sheet to enable an engineer or technician to easily make diagrams or printed circuit board layouts without having to refer to a manufacturer's catalog.

REFERENCES:
patent: 3460281 (1969-08-01), Levy
patent: 3769895 (1973-11-01), Lucas

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