Label continuum and producing method thereof

Stock material or miscellaneous articles – Layer or component removable to expose adhesive

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

283 81, 428 408, 428 412, 428 414, 428 416, 428 417, 428 418, 428 421, 428 422, 428 423, 428 43, 428906, G09F 302

Patent

active

057231907

ABSTRACT:
This invention relates to a label continuum comprising a long label substrate, an adhesive layer formed on the back thereof, a heat-sensitive developing layer formed on the surface of the label substrate and a release layer formed on the surface of the label substrate opposite to the adhesive layer when the label substrate is rolled up.
The invention also relates to a producing method of the label continuum which comprises a step 1 of preparing a process sheet with at least either surface thereof having a releasability and forming an adhesive layer on the release surface of the process sheet, a step 2 of preparing a long label substrate with the back to which the adhesive layer is transferred and stuck and of mating together the back of the label substrate and the adhesive layer of the process sheet, a step 3 of forming a release layer on the surface of the label substrate, a step 4 of releasing only the process sheet from the surface of the adhesive layer transferred to the back of the label substrate, and a step 5 of rolling up the label substrate so that the release layer and the adhesive layer are false-stuck to each other.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Label continuum and producing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Label continuum and producing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Label continuum and producing method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2245839

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.