Label assemblies without die-cutting

Details Label assemblies without die-cutting Label assemblies without die-cutting

1976-08-27

1977-05-10

Van Balen, William J.

Stock material or miscellaneous articles

Layer or component removable to expose adhesive

Dissimilar adhesives

427 43, 427 44, 427 54, 427265, 428354, 428355, 428914, B32B 310, B32B 2716

Patent

active

040229262

ABSTRACT:
A method for making a novel assembly of laid-on labels, without die-cutting, is described. The method comprises printing over the release surface of a temporary carrier web a liquid pressure-sensitive adhesive in a predetermined pattern of discrete label areas separated by intervening areas of the carrier, solidifying the adhesive surface, forming a continuous film of radiation polymerizable liquid over each adhesive area, the film over each area being unconnected to films over adjacent areas, and exposing the films to radiation sufficient to solidify them by polymerization. Preferably the films extend over the edges of the adhesive and comprise liquids which do not wet the release surface.

REFERENCES:
patent: 3519525 (1970-07-01), Jackstadt
patent: 3989609 (1976-11-01), Brack

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