Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2006-07-25
2006-07-25
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S784000
Reexamination Certificate
active
07081376
ABSTRACT:
Disclosed is a method for forming a heat sink laminate and a heat sink laminate formed by the method. In the method a particle mixture is formed from a metal, an alloy or mixtures thereof with a ceramic or mixture of ceramics. The mixture is kinetically sprayed onto a first side of a dielectric material to form a metal matrix composite layer. The second side of the dielectric material is thermally coupled to a heat sink baseplate, thereby forming the heat sink laminate.
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Elmoursi Alaa A.
Fuller Brian K.
Gillispie Bryan A.
Gorkiewicz Daniel W.
Morelli Donald T.
Delphi Technologies Inc.
McBain Scott A.
Nelms David
Nguyen Thinh T
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