Kinetic solder paste composition

Details Kinetic solder paste composition Kinetic solder paste composition

1993-03-08

1994-07-12

Rosenberg, Peter D.

Metal treatment

Compositions

148 24, B23K 3534

Patent

active

053285212

ABSTRACT:
A solder paste composition containing (a) 4-96% by weight finely divided particles of eutectic or pseudo-eutectic metal alloy or mixtures; (b) 96-4% by weight finely divided particles of a metal additive consisting of pure metal, mixtures or alloys thereof having a melting point of at least 30.degree. C. greater than the metal alloy in (a); and (c) an organic medium. The paste is particularly useful for surface mounting metallized components to metallized substrates in microelectronic packaging.

REFERENCES:
patent: 4938924 (1990-07-01), Ozaki

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