KGD carrier and an IC mounting socket mounting it

Details KGD carrier and an IC mounting socket mounting it KGD carrier and an IC mounting socket mounting it

2002-11-08

2004-06-22

Nasri, Javaid H. (Department: 2839)

Electrical connectors

Coupling part having handle or means to move contact...

C439S526000

Reexamination Certificate

active

06752643

ABSTRACT:

This application is based on Patent Application No. 2001-346330 filed Nov. 12, 2001 in Japan, the content of which is incorporated hereinto by reference.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a KGD carrier, more particularly to a KGD carrier having the structure around the substrate thereof improved and an IC socket for mounting the KGD carrier.
2. Description of the Related Art
In the conventional way, when subjecting a non-package chip (or die) satisfying the given specifications, i.e., a KGD (Known Good Die), to the burn-in test, it has been a common practice that the KGD to be tested is once mounted on a special carrier, and the carrier mounted with the KGD is then mounted on an IC socket. Then, the IC socket is incorporated into a test board to undergo the burn-in test.
The structure of a conventional KGD carrier for mounting the KGD will be described briefly referring to FIG.
5
.
FIG. 5
shows a cross-sectional view of the carrier mounted with an IC chip.
The KGD carrier
10
comprises a carrier retaining member
20
and a carrier base assembly
30
.
The carrier retaining member
20
comprises a cover
21
, a chip retaining member
22
, a coil spring
23
and a steel ball
24
so that the IC chip
40
placed on the carrier base assembly
30
can be held elastically.
The carrier substrate
30
comprises a carrier body
31
including a latch
36
for locking the carrier retaining member
20
with the carrier base assembly
30
, a substrate (a contact seat)
32
as being a printed-circuit board, an elastomer frame
33
, an elastomer
34
as being a cushion to be placed in the elastomer frame
33
, and a carrier base
35
. The carrier body
31
, the substrate
32
, the elastomer frame
33
and the carrier base
35
are integrated into a single body by using screws or the like (not shown) to form a carrier base assembly
30
. The film-like substrate
32
needs to be kept open so that the pad
32
a
placed therearound can electrically be connected with the contact of the IC socket. Therefore, in order to prevent the substrate
32
, especially the peripheral portion thereof, from becoming saggy, the substrate
32
is previously bonded to the elastomer frame
33
(or to the carrier base
35
if the elastomer frame
33
is omitted) or to the carrier body
31
.
The IC chip
40
is mounted on the carrier
10
in a fashion described below. First, while the carrier retaining member
20
is removed, the IC chip
40
is placed on the substrate
32
. Subsequently, the carrier retaining member
20
is used to press the IC chip
40
inward evenly and elastically until coming into close contact with the substrate
32
, thereby enabling the IC chip
40
and the substrate
32
to be electrically connected with each other. Further, the latch
36
is made to engage with a cover
21
of the carrier retaining member
20
to complete the mounting of the IC chip
40
as illustrated in FIG.
5
.
The carrier
10
mounted with the IC chip
40
is further mounted on an IC socket
50
as is shown in FIG.
6
.
The IC socket
50
comprises an operating cover
51
, a socket base
52
and a contact
53
which includes a contact portion
53
a
, an elastic portion
53
b
, a stationary portion
53
c
and a terminal portion
53
d
. The IC socket
50
is designed so that the contact portion
53
a
of the contact
53
moves back away from and forth toward a pad
32
a
, which is formed on the substrate
32
of the carrier
10
mounted on the IC socket
50
, as the operating cover
51
moves up and down.
In order for the carrier
10
to be mounted on the IC socket
50
, the operating cover
51
needs to be pushed downward to make the contact portion
53
a
of the contact
53
to retreat. Then the carrier
10
enables to be positioned and placed on a mounting base
52
a
of the socket base
52
. Subsequently, when the downward pushing force of the operating cover
51
is released, the operating cover
51
rises because of the restoring force of the spring (not shown). Then, the contact portion
53
a
of the contact
53
returns to its original position and abuts the pad
32
a
of the substrate
32
of the carrier
10
. Consequently, the substrate
32
(i.e., the IC chip
40
) is electrically connected with the contact
53
.
The IC chip
40
, mounted on the IC socket
50
through the carrier
10
in the previously described manner, is then set in a test board (not shown) to undergo the burn-in test.
As described previously, in the case of the conventional carrier
10
, the substrate
32
is bonded to the elastomer frame
33
and the carrier base
35
or the carrier body
31
, so that, for example as shown in
FIG. 6
, the substrate
32
is in contact with the contact
53
of the IC socket
50
only at one point, which may result in unstable electrical connection.
In consideration of the point discussed above, the present invention is designed to provide a KGD carrier capable of obtaining sure electric connection by enabling the substrate of the KGD carrier base assembly and the contact of the IC socket to contact with each other at 2 points.
SUMMARY OF THE INVENTION
In order to attain the above object, the KGD carrier according to the present invention is designed to hold the IC chip by means of the carrier retaining member and the carrier base assembly. The carrier base assembly comprises the carrier body, the carrier base and the substrate. The carrier body is provided with grooves, which are located opposing pads formed around the substrate, to permit the in-and-out motion of contacts of the IC socket. The carrier base is also provided with grooves, which are located opposing the pads formed around the substrate, to permit the in-and-out motion of the contacts of the IC socket. The substrate is interposed between the carrier body and the carrier base to enable the pads and the corresponding contacts to be connected electrically with each other.
The above and other objects, effects, features and advantages of the present invention will become more apparent from the following description of embodiments thereof taken in conjunction with the accompanying drawings.


REFERENCES:
patent: 3746157 (1973-07-01), I'Anson
patent: 4886470 (1989-12-01), Billman et al.

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