Electricity: conductors and insulators – Anti-inductive structures – Conductor transposition
Reexamination Certificate
2006-06-20
2006-06-20
Lee, Jinhee (Department: 2831)
Electricity: conductors and insulators
Anti-inductive structures
Conductor transposition
C174S034000, C174S135000
Reexamination Certificate
active
07064264
ABSTRACT:
A keyed filler panel with integrated recessed region for attaching device is disclosed. In one embodiment, the present invention includes a filler panel body. The present embodiment also includes a recessed portion integral with the filler panel body. The recessed portion is fixedly coupled with the filler panel body, and adapted to receive an attaching device for removably coupling the filler panel body with respect to a chassis.
REFERENCES:
patent: 6098133 (2000-08-01), Summers et al.
patent: 6285548 (2001-09-01), Hamlet et al.
Cerniglia Sean A.
Greenside Michael J.
Hewlett--Packard Development Company, L.P.
Lee Jinhee
LandOfFree
Keyed filler panel with integrated recessed region for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Keyed filler panel with integrated recessed region for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Keyed filler panel with integrated recessed region for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3634719