Kelvin contact module for a microcircuit test system

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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C439S886000

Reexamination Certificate

active

11449119

ABSTRACT:
A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly and in interfering relation with features of a housing that supports and aligns the contact assemblies, to apply force to the slider contacts to force them against the microcircuit terminals.

REFERENCES:
patent: 4577922 (1986-03-01), Stipanuk et al.
patent: 4921430 (1990-05-01), Matsuoka
patent: 5096426 (1992-03-01), Simpson et al.
patent: 5967848 (1999-10-01), Johnson et al.

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