Junction vertical field effect transistor and process for the pr

Metal working – Method of mechanical manufacture – Assembling or joining

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29578, 29580, 148 15, 357 22, 357 55, 357 59, 156654, 156657, H01L 2906

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active

045050228

ABSTRACT:
This transistor comprises a first main surface of alternating source and gate strips. A gate metallization rests on the gate strips and a source metallization rests on a polycrystalline silicon rail formed above the source strips. Such a device can be manufactured by entirely self-aligned methods and is applicable particularly to the very high frequency range up to a few dozen gigahertz.

REFERENCES:
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patent: 4070690 (1978-01-01), Wickstrom
patent: 4129879 (1978-12-01), Tantraporn et al.
patent: 4262296 (1981-04-01), Sheely et al.
patent: 4337115 (1982-06-01), Ikeda et al.
IEEE Transactions On Electron Devices, vol. ED-25, No. 3, Mar. 1978, New York, J. I. Nishizawa et al.: "High-Frequency High-Power Static Induction Transistor", pp. 314-322.
IEEE International Electron Devices Meeting, Technical Digest, Dec. 4-6, 1978, Washington (New York), J. Nishizawa et al.: "Bipolar Mode Static Induction Transistor (BSIT)-High Speed Switching Device," pp. 676-679.
IEEE Transactions On Electron Devices, vol. ED-25, No. 1, Jan. 1978 (New York), Oamu Ozawa et al.: "A Vertical FET with Self-Aligned Ion-Implanted Source and Gate Regions", pp. 56-57.
IEEE Transactions On Electron Devices, vol. ED-26, No. 4, Apr., 1979 (New York), T. Sakai et al.: "Elevated Electrode Integrated Circuits", pp. 379-385.
Solid State Electronics, vol. 21, No. 9, Sep. 1978, Pergamon Press Ltd., B. A. Boxall: "A Technique For Producing Polysilicon Patterns With Bevelled Edge Profiles Using Wet Etching", pp. 1173-1174.

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