Junction substrate and method of bonding substrates together

Details Junction substrate and method of bonding substrates together Junction substrate and method of bonding substrates together

2007-04-17

2007-04-17

Smith, Matthew (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S686000, C257SE23020, C257SE23040, C438S109000, C438S118000, C438S406000, C438S455000

Reexamination Certificate

active

10916203

ABSTRACT:
A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.

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