Junction substrate and method of bonding substrates together

Details Junction substrate and method of bonding substrates together Junction substrate and method of bonding substrates together

2011-01-11

2011-01-11

Goff, John L (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

C438S456000

Reexamination Certificate

active

07867346

ABSTRACT:
A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.

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