Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2004-10-08
2011-10-25
Gebremariam, Samuel (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S723000, C257S777000, C257SE23070, C257SE23175
Reexamination Certificate
active
08044518
ABSTRACT:
A second semiconductor chip and a junction member are mounted on a first semiconductor chip formed with a plurality of first pads on a surface thereof. A resin encapsulating body is provided which seals the first semiconductor chip, the second semiconductor chip and the junction member. The second semiconductor chip includes a plurality of second pads arranged in a central part thereof. The junction member includes first junction pads, second junction pads and connecting portions which connect the first junction pads and the second junction pads respectively. Electrical connections of the second semiconductor chip from the second pads include connections to connecting terminals and connections to the connecting terminals or the first semiconductor chip from the second junction pads via the first junction pads.
REFERENCES:
patent: 5354955 (1994-10-01), Gregor et al.
patent: 6278616 (2001-08-01), Gelsomini et al.
patent: 6351040 (2002-02-01), Schoenfeld
patent: 6392950 (2002-05-01), Ayukawa et al.
patent: 6421254 (2002-07-01), Crane et al.
patent: 6552418 (2003-04-01), Misumi et al.
patent: 6916686 (2005-07-01), Wada et al.
patent: 6979905 (2005-12-01), Nishida et al.
patent: 7098528 (2006-08-01), Vasishta et al.
patent: 2003/0153122 (2003-08-01), Brooks
patent: 07-050315 (1995-02-01), None
patent: 08-288453 (1996-11-01), None
patent: 2001-177050 (2001-06-01), None
patent: 2001-344967 (2001-12-01), None
patent: 2002-93993 (2002-03-01), None
patent: 2003-234359 (2003-08-01), None
English-Language Machine Translation of JP 2001-177050. Retreived Sep. 29, 2008 from JPO webpage.
Arena Andrew O.
Gebremariam Samuel
Oki Semiconductor Co., Ltd.
Rabin & Berdo P.C.
LandOfFree
Junction member comprising junction pads arranged in matrix... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Junction member comprising junction pads arranged in matrix..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Junction member comprising junction pads arranged in matrix... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4255073