Josephson junction device having intermetallic in electrodes

Details Josephson junction device having intermetallic in electrodes Josephson junction device having intermetallic in electrodes

1975-11-20

1976-12-21

Edlow, Martin H.

Electrical transmission or interconnection systems

Nonlinear reactor systems

Parametrons

357 4, 307306, H01L 2712

Patent

active

039992039

ABSTRACT:
A Josephson junction device using intermetallic compounds in its electrodes to reduce stress relaxation, such as hillock growth, during temperature cycling. The intermetallic compounds are present in only the base electrode or in both the base electrode and the counter electrode. For lead electrodes, intermetallics of gold, platinum, palladium, magnesium, tellurium, etc. are suitable. Other superconductors and their intermetallics can also be used for the electrode structures. Low tunneling resistance and high Josephson current result, and the tunneling barriers are uniform and dense.

REFERENCES:
patent: 3689780 (1972-09-01), Meissner
patent: 3733526 (1973-05-01), Anacher
patent: 3816173 (1974-06-01), Eldridge
Lumpkin, I.B.M. Tech. Discl. Bull., vol. 10, No. 5, Oct. 1967, p. 679.
Leder, Cryogenics, Dec. 1968, pp. 364-371.
Adler et al., Canadian Journal of Physics, vol. 43 (Apr. 1965).

Affiliated with

Also associated with

Rating

Josephson junction device having intermetallic in electrodes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Josephson junction device having intermetallic in electrodes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Josephson junction device having intermetallic in electrodes will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1842655