Joint structure of metal member and ceramic member and method of

Details Joint structure of metal member and ceramic member and method of Joint structure of metal member and ceramic member and method of

1998-01-26

2000-05-02

Kincaid, Kristine

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 361234, 361748, 29843, 279128, 257700, H05K 116

Patent

active

060575131

ABSTRACT:
A joint structure having a metal member and a ceramic member having a housing hole for accommodating at least a part of the metal member therein, in which an electrically conductive joint layer is formed between a bottom face of the metal member and a bottom face of the housing hole, and a film having a given wettability by the electrically conductive joint layer is formed on at least a part of the side wall face of the metal member.

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Patent Abstracts of Japan, vol. 014, No. 459, Oct. 4, 1990 & JP 02 188475 A, Jul. 24, 1990 Abstract.
Patent Abstracts of Japan, vol. 014, No. 253 (P-1054), May 30, 1990 & JP 02 067508 A, Mar. 7, 1990 Abstract.
Patent Abstracts of Japan, vol. 009, No. 226, Sep. 12, 1985, & JP 60 082267 A, May 10, 1985 Abstract.

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