Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With mating connector which receives panel circuit edge
Reexamination Certificate
1998-11-17
2001-04-24
Donovan, Lincoln (Department: 2832)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With mating connector which receives panel circuit edge
C439S327000
Reexamination Certificate
active
06220867
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to a join-structure of high-density connector and interface module, particularly to a join-structure of high-density connector and interface module that can save connecting material, hold connection firmly, and facilitate easy mounting and dismounting of an interface module.
2. Description of the Prior Art
A conventional join-structure of high-density connector and interface module usually has two categories in its conductive terminals, including a cutting face lateral contact type (abbrev. as type A hereinafter) and a folded plate contact type (abbrev. as type B hereinafter). U.S. Pat. Nos. 5,071,371 and 5,425,658 are examples of type A, wherein two separated pairs (4 terminal pieces) overlap each other in most of their areas, and the employed terminal material is in relatively large amount that seemed to have been overdone. In another U.S. Pat. No. 5,024,609 of type B, a component separator is used to fix and align the conductive strips that increases manpower, production cost, and complexity.
A U.S. patent application Ser. No. 08/430952 applied on Apr. 28, 1995 (ROC patent No. 312859) is a conventional join-structure of connector and interface module, wherein terminals in upper and middle layers are installed in straight lines in a reception slot, and volume of the entire body and needed terminal material are enlarged because of mounting of terminals at two lateral ends. And moreover, terminals in middle layer is prone to contact with that in lower layer when plugging in or pulling out a daughter board, so that, its function as well as usage has been compressed.
With respect to prior skill of join-structure of high-density connector and interface module, please refer to U.S. Pat. No. 5,026,292, wherein terminal of type A and B both are used in a connector that may require complicated procedures in manufacturing and assembling.
Major embodiments in U.S. Pat. No. 5,051,099 employ the same conductive strips as of type A and B in the mentioned U.S. Pat. No. 5,026,292, wherein
FIG. 8
indicates another embodiment using terminals arranged in an upper as well as a lower layer respectively, and the terminals are laminated and polished aside that cannot contact with conductive strips thoroughly.
Moreover,
FIG. 9
in the aforesaid patent reveals a type B embodiment, wherein the flaglike contact realm of the lower layer terminals requires a larger activity space that results in an enlarged slot at upper portion for reception a daughter board. However, owing to lack of guiding and positioning function, the daughter board cannot be plugged in the slot easily that may deform or impair the terminals to no longer coincide with golden fingers of the daughter board in geometric progression interval alignment (abbrev. as GPIA hereinafter).
Design of a usual join-structure of connector and interface module has progressed in GPIA alignment as revealed in U.S. patent application Ser. No. 08/712868 (ROC patent No. 304284), wherein terminals of type A and B have been employed and arranged in an upper layer as well as a lower layer disposed in a single reception slot, however, in case a defect is found in manufacturing process or in the upper layer of a finished product, the intact lower layer has to be dismounted before removing or replacing the erroneous upper layer. This troublesome maintenance procedure will cost considerable manpower that has to be improved for sure.
Besides, a known retention mechanism, which can be applied to hold either a card type or a cartridge type interface module, is weak in dismounting procedure. A user has to use his hands to hold and pull an interface module out from the slot bit by bit and end by end. Such an inconvenient dismounting operation is also in need of improvement conspicuously.
In view of the aforesaid imperfections, and after years of constant efforts in research, this invention is taking the opportunity to propose a preferred structure, which is to be summarized below.
SUMMARY OF THE INVENTION
The main object of this invention is to provide a join-structure of high-density connector and interface module, wherein terminals of a lateral contact type, which is designed to save material, area, and volume, will be plugged in a reception slot and fixed firmly. Another object of this invention is to provide a join-structure of high-density connector and interface module, wherein terminals of a plate face contact type designed staggering in root ends can be torn up for material saving.
One more object of this invention is to provide a join-structure of high-density connector and interface module, wherein positioning pins are either plugged to anchor or pivoted to anchor for fixing the retention mechanism onto a motherboard.
Another more object of this invention is to provide a join-structure of high-density connector and interface module, wherein fixing pins are employed to fix and latch a heat sink to the daughter board for low cost and easy assembly purposes.
A further object of this invention is to provide a join-structure of high-density connector and interface module, wherein a movable frame on the retention mechanism is foldable inwards or exchangeable to retain a card type or a cartridge type interface module for multipurpose application.
A furthermore object of this invention is to provide a join-structure of high-density connector and interface module, wherein a flexible portion and a snap fastening portion of the retention mechanism cooperating with a movable piece can release simply and rapidly the fastened interface module from the retention mechanism.
With the above-described merits, the join-structure of high-density connector and interface module comprises a dielectric housing unit, a plurality of terminals, an interface card, a heat sink, a retention mechanism and a motherboard, wherein two kinds of structure of a conductive strip are available—a cutting face lateral contact and a folded plate contact; for the former, a material feeding band is punched to form simultaneously two different independent terminal sets in zigzag alignment at opposite sides that can be torn up easily; and for the latter, the alignment is the same as in the former, while the root portion includes two sections, and a enhancing protruded strip is provided at two turning points in a terminal; and the terminals are snap-fastened to the reception slot in the dielectric housing unit.
REFERENCES:
patent: 3582865 (1971-06-01), Franck et al.
patent: 3991346 (1976-11-01), Reid et al.
patent: 4533978 (1985-08-01), Walter
patent: 5449297 (1995-09-01), Bellomo et al.
patent: 5478259 (1995-12-01), Noschese
patent: 5662485 (1997-09-01), Yip et al.
Donovan Lincoln
Lee Kyung S.
Pro-Techtor Inter-national Services
Win Win Precision Industrial Co., Ltd.
LandOfFree
Joining-structure for a high-density connector and interface... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Joining-structure for a high-density connector and interface..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Joining-structure for a high-density connector and interface... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2487356