Joining of composite materials by induction heating

Details Joining of composite materials by induction heating Joining of composite materials by induction heating

1990-09-06

1993-08-31

Woo, Jay H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1562751, 1563797, 1563802, 1563806, 219 1043, 219 1053, 219 1075, B23K 1301

Patent

active

052405427

ABSTRACT:
Two pieces of composite material are simultaneously joined together throughout an interface between the two pieces, by induction heating the interface region with an induction coil placed, at least in part, adjacent to the bonding region, and forcing the composite material at the interface together while heating. The approach is particularly useful in joining pieces having "long interfaces" whose longitudinal dimension is substantially larger than its transverse dimension, for example the long interfaces between aircraft wing stiffeners and skins. The induction coil is configured so that, at any one longitudinal location along the interface, the primary current flowing therethrough does not flow in opposite directions in the portions of the coil overlying the interface, and preferably flows in substantially the same direction throughout the interface. Unheated "cold spots" in the interface being bonded, which would not bond properly, are thereby avoided. An electrically nonconductive but thermally conductive material may be placed between the induction coil and the composite material pieces to act as both a heat sink and a pressure-applying tool. Bonding may be enhanced by placing a susceptor made of the same materials as the composite materials being bonded but having a higher electrical conductivity, in the interface between the two composite material pieces prior to induction heating.

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G. Williams et al., "Induction welding of thermoplastic composites", I. Meche (1990), pp. 133-136.
John Border, "Induction Heated Joining of Thermoplastic Composites Without Metal Susceptors," 34th Int. SAMPE Symposium (1989), 2569-78.

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